2020IEEE Transactions on Power ElectronicsOpen access

Opportunities, Challenges, and Potential Solutions in the Application of Fast-Switching SiC Power Devices and Converters

Xibo Yuan, Ian Laird, Sam Walder

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Abstract

Power devices based on wide-bandgap material such as silicon carbide (SiC) can operate at higher switching speeds, higher voltages, and higher temperatures compared to those based on silicon material. This article highlights some opportunities brought by SiC devices in existing and emerging applications in terms of efficiency and power density improvement. While the opportunities are clear, there are also design challenges that must be met in order to realize their full potential. For example, the fast switching speeds and high dv/dt of SiC devices can cause increased electromagnetic interference, current overshoot, cross-talk effect, and have a negative impact on loads such as motors. This article presents several potential solutions to tackle the application challenges and to fully exploit the superior characteristics of SiC devices and converters while attenuating their negative side effects. This article provides an overview of recent SiC device research and development activities based on academic literature, work carried out by the authors and collaborators as well as input from industry. It aims to provide benchmark results and a timely and useful reference to accelerate the adoption and deployment of SiC devices and converters.

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What this paper is about

Power devices based on wide-bandgap material such as silicon carbide (SiC) can operate at higher switching speeds, higher voltages, and higher temperatures compared to those based on silicon material. This article highlights some opportunities brought by SiC devices in existing and emerging applications in terms of efficiency and power density improvement. While the opportunities are clear, there are also design challenges that must be met in order to realize their full potential. For example, the fast switching speeds and high dv/dt of SiC devices can cause increased electromagnetic interference, current overshoot, cross-talk effect, and have a negative impact on loads such as motors. This article presents several potential solutions to tackle the application challenges and to fully exploit the superior characteristics of SiC devices and converters while attenuating their negative side effects. This article provides an overview of recent SiC device research and development activities based on academic literature, work carried out by the authors and collaborators as well as input from industry. It aims to provide benchmark results and a timely and useful reference to accelerate the adoption and deployment of SiC devices and converters.

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Available abstract

Power devices based on wide-bandgap material such as silicon carbide (SiC) can operate at higher switching speeds, higher voltages, and higher temperatures compared to those based on silicon material. This article highlights some opportunities brought by SiC devices in existing and emerging applications in terms of efficiency and power density improvement. While the opportunities are clear, there are also design challenges that must be met in order to realize their full potential. For example, the fast switching speeds and high dv/dt of SiC devices can cause increased electromagnetic interference, current overshoot, cross-talk effect, and have a negative impact on loads such as motors. This article presents several potential solutions to tackle the application challenges and to fully exploit the superior characteristics of SiC devices and converters while attenuating their negative side effects. This article provides an overview of recent SiC device research and development activities based on academic literature, work carried out by the authors and collaborators as well as input from industry. It aims to provide benchmark results and a timely and useful reference to accelerate the adoption and deployment of SiC devices and converters.

Key concepts: Converters, Silicon carbide, Benchmark (surveying), Exploit, Electronic engineering, Software deployment, Power semiconductor device, Power (physics)

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