2020•Unpublished venueRequires access

"Molded-package-last" Process for Fan-out System in Package (FO-SiP)

Tomoaki Shibata, Tsuyoshi Ogawa, Xinrong Li, Satoshi Yoneda, Naoya Suzuki, Toshihisa Nonaka

Abstract

"Molded-package-last" process has been newly developed for fan-out system in package fabrication. In this process, the RDL and the molded-package including IC and passive component were separately fabricated, and then assembled by second molding and reflow process for main and collective bonding. Molded-package-last process doesn't need long serial fabrication process, therefore it is highly productive compared with conventional chip last or chip first method. The obtained package showed good alignment accuracy between the RDL and the molded-package, and moreover, good solder connection.

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Available abstract

Key concepts: Package on package, Process (computing), Fan-out, System in package, Molding (decorative), Fabrication, Chip-scale package, Chip