2009•Rare Metals and Cemented CarbidesRequires access

Numerical Simulation and Technical Study of Superplastic Forming/Diffusion Bonding for Ti Alloy Sheet

Dou Xiao-li

Abstract

The finite element Marc software was used to numerically simulate the processes of superplastic forming/diffusion bonding of TC4,a Ti alloy sheet.Based on the optimized pressure-time(p-t) curve obtained from simulation,the following experiments of superplastic forming/diffusion bonding were carried out.The experimental results show that the optimal technological parameters of TC4 superplastic forming/diffusion bonding are as follows: superplastic forming——θ=900 ℃,p=2.5 MPa,t=790 s;diffusion bonding——θ=900 ℃,p=3 MPa,t=80 min.

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Key concepts: Superplasticity, Diffusion bonding, Materials science, Diffusion, Alloy, Metallurgy, Finite element method, Die (integrated circuit)