2019•Extended Abstracts of the 2019 International Conference on Solid State Devices and MaterialsRequires access

Packaging of SiC power device for miniaturization of power electronics system- fast switching operation and thermal management -

Tsuyoshi Funaki

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Key concepts: Miniaturization, Materials science, Thermal management of electronic devices and systems, Power electronics, Electronics, Power (physics), Power module, Electrical engineering

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Packaging of SiC power device for miniaturization of power electronics system- fast switching operation and thermal management - — Research Paper | ScholarLens