2019SensorsOpen access

Nano-Cracked Strain Sensor with High Sensitivity and Linearity by Controlling the Crack Arrangement

Hyun Suk Jung, Chan Park, Hyun–Woo Lee, Seong‐Uk Hong, Hyonguk Kim, Seong Jin Cho

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Abstract

Studies on wearable sensors that monitor various movements by attaching them to a body have received considerable attention. Crack-based strain sensors are more sensitive than other sensors. Owing to their high sensitivity, these sensors have been investigated for measuring minute deformations occurring on the skin, such as pulse. However, existing studies have limited sensitivity at low strain range and nonlinearity that renders any calibration process complex and difficult. In this study, we propose a pre-strain and sensor-extending process to improve the sensitivity and linearity of the sensor. By using these pre-strain and sensor-extending processes, we were able to control the morphology and alignment of cracks and regulate the sensitivity and linearity of the sensor. Even if the sensor was fabricated in the same manner, the sensor that involved the pre-strain and extending processes had a sensitivity 100 times greater than normal sensors. Thus, our crack-based strain sensor had high sensitivity (gauge factor > 5000, gauge factor (GF = (△R/R0)/ε), linearity, and low hysteresis at low strain (<1% strain). Given its high sensing performance, the sensor can be used to measure micro-deformation, such as pulse wave and voice.

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Studies on wearable sensors that monitor various movements by attaching them to a body have received considerable attention. Crack-based strain sensors are more sensitive than other sensors. Owing to their high sensitivity, these sensors have been investigated for measuring minute deformations occurring on the skin, such as pulse. However, existing studies have limited sensitivity at low strain range and nonlinearity that renders any calibration process complex and difficult. In this study, we propose a pre-strain and sensor-extending process to improve the sensitivity and linearity of the sensor. By using these pre-strain and sensor-extending processes, we were able to control the morphology and alignment of cracks and regulate the sensitivity and linearity of the sensor. Even if the sensor was fabricated in the same manner, the sensor that involved the pre-strain and extending processes had a sensitivity 100 times greater than normal sensors. Thus, our crack-based strain sensor had high sensitivity (gauge factor > 5000, gauge factor (GF = (△R/R0)/ε), linearity, and low hysteresis at low strain (<1% strain). Given its high sensing performance, the sensor can be used to measure micro-deformation, such as pulse wave and voice.

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Available abstract

Studies on wearable sensors that monitor various movements by attaching them to a body have received considerable attention. Crack-based strain sensors are more sensitive than other sensors. Owing to their high sensitivity, these sensors have been investigated for measuring minute deformations occurring on the skin, such as pulse. However, existing studies have limited sensitivity at low strain range and nonlinearity that renders any calibration process complex and difficult. In this study, we propose a pre-strain and sensor-extending process to improve the sensitivity and linearity of the sensor. By using these pre-strain and sensor-extending processes, we were able to control the morphology and alignment of cracks and regulate the sensitivity and linearity of the sensor. Even if the sensor was fabricated in the same manner, the sensor that involved the pre-strain and extending processes had a sensitivity 100 times greater than normal sensors. Thus, our crack-based strain sensor had high sensitivity (gauge factor > 5000, gauge factor (GF = (△R/R0)/ε), linearity, and low hysteresis at low strain (<1% strain). Given its high sensing performance, the sensor can be used to measure micro-deformation, such as pulse wave and voice.

Key concepts: Nano-, Linearity, Sensitivity (control systems), Materials science, Strain (injury), Composite material, Structural engineering, Electronic engineering

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