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Study on thermal properties of graphene foam/graphene sheets filled polymer composites Part A Applied science and manufacturing

Yunhong Zhao, Zhenkun Wu, Shu‐Lin Bai

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Abstract

The polymer composites composed of graphene foam (GF), graphene sheets (GSs) and pliable polydimethylsiloxane (PDMS) were fabricated and their thermal properties were investigated. Due to the unique interconnected structure of GF, the thermal conductivity of GF/PDMS composite reaches 0.56Wm⁻¹K⁻¹, which is about 300% that of pure PDMS, and 20% higher than that of GS/PDMS composite with the same graphene loading of 0.7wt%. Its coefficient of thermal expansion is (80–137)×10⁻⁶/K within 25–150°C, much lower than those of GS/PDMS composite and pure PDMS. In addition, it also shows superior thermal and dimensional stability. All above results demonstrate that the GF/PDMS composite is a good candidate for thermal interface materials, which could be applied in the thermal management of electronic devices, etc.

About this research paper

What this paper is about

The polymer composites composed of graphene foam (GF), graphene sheets (GSs) and pliable polydimethylsiloxane (PDMS) were fabricated and their thermal properties were investigated. Due to the unique interconnected structure of GF, the thermal conductivity of GF/PDMS composite reaches 0.56Wm⁻¹K⁻¹, which is about 300% that of pure PDMS, and 20% higher than that of GS/PDMS composite with the same graphene loading of 0.7wt%. Its coefficient of thermal expansion is (80–137)×10⁻⁶/K within 25–150°C, much lower than those of GS/PDMS composite and pure PDMS. In addition, it also shows superior thermal and dimensional stability. All above results demonstrate that the GF/PDMS composite is a good candidate for thermal interface materials, which could be applied in the thermal management of electronic devices, etc.

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Available abstract

The polymer composites composed of graphene foam (GF), graphene sheets (GSs) and pliable polydimethylsiloxane (PDMS) were fabricated and their thermal properties were investigated. Due to the unique interconnected structure of GF, the thermal conductivity of GF/PDMS composite reaches 0.56Wm⁻¹K⁻¹, which is about 300% that of pure PDMS, and 20% higher than that of GS/PDMS composite with the same graphene loading of 0.7wt%. Its coefficient of thermal expansion is (80–137)×10⁻⁶/K within 25–150°C, much lower than those of GS/PDMS composite and pure PDMS. In addition, it also shows superior thermal and dimensional stability. All above results demonstrate that the GF/PDMS composite is a good candidate for thermal interface materials, which could be applied in the thermal management of electronic devices, etc.

Key concepts: Materials science, Composite material, Polydimethylsiloxane, Graphene, Composite number, Thermal conductivity, Thermal expansion, Thermal stability

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Study on thermal properties of graphene foam/graphene sheets filled polymer composites Part A Applied science and manufacturing — Research Paper | ScholarLens