2019•Springer proceedings in physicsRequires access

Effect of Cu Content on Microstructure and Properties of Al–Mg–Si Alloy

Hongxiang Li, Shengli Guo, Peng Du, Shengpu Liu

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Key concepts: Microstructure, Alloy, Materials science, Ultimate tensile strength, Scanning electron microscope, Optical microscope, Transmission electron microscopy, Electrical resistivity and conductivity

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Effect of Cu Content on Microstructure and Properties of Al–Mg–Si Alloy — Research Paper | ScholarLens