Minority Carrier Lifetime Variations in Multicrystalline Silicon Wafers with Temperature and Ingot Position
Sissel Tind Sondergaard, Jan Ove Odden, Rune Strandberg
Abstract
Sissel Tind Sondergaard, Jan Ove Odden, Rune Strandberg
Abstract
The minority carrier lifetimes of multicrystalline silicon wafers are mapped using microwave photoconductive decay for different temperatures and ingot positions. Wafers from the top of the ingot display larger areas with lower lifetimes compared to wafers from the bottom. The lifetimes of low-lifetime areas are found to increase with the temperature, while the lifetimes of some high-lifetime areas decrease or remain unchanged. The relative improvement of the low-lifetime areas is considerably larger than the relative change in the high-lifetime areas. We suggest that the above-mentioned observations explain, at least partially, why previous studies have found the relative temperature coefficients of mc-Si cells to improve towards the top of the ingot.
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The minority carrier lifetimes of multicrystalline silicon wafers are mapped using microwave photoconductive decay for different temperatures and ingot positions. Wafers from the top of the ingot display larger areas with lower lifetimes compared to wafers from the bottom. The lifetimes of low-lifetime areas are found to increase with the temperature, while the lifetimes of some high-lifetime areas decrease or remain unchanged. The relative improvement of the low-lifetime areas is considerably larger than the relative change in the high-lifetime areas. We suggest that the above-mentioned observations explain, at least partially, why previous studies have found the relative temperature coefficients of mc-Si cells to improve towards the top of the ingot.
Key concepts: Ingot, Wafer, Carrier lifetime, Materials science, Silicon, Photoconductivity, Optoelectronics, Microwave