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2018•Unpublished venueRequires access

Analysis of RF transmission performance of 3D TSV interposer

Zhengduo Wang, Fengshun Wu, Liang Lang, Bo Wang

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Abstract

In this paper, some potential influencing factors of the TSV (Through Silicon Via) interposer were analyzed in high frequency bands from 10 GHz to 50 GHz by HFSS software. An interposer model with QFN (Quad Flat No-lead Package)-BGA (Ball Grid Array) transmission structure was designed to investigate the influence of the parameters such as shape, distance of BGA solder joint and TSV. In the model, TSV was used to connect QFN pad and BGA balls to transmit signal. According to the simulation results, the shape and distance of BGA balls significantly affect the RF transmission performance. A cylinder-shape BGA solder joint has better performance. In addition, the radius, distance and shape of TSV have obvious influence on the transmission performance of the interposer in the relative high frequency bands. The T-shape of TSV, short distance between RF TSV and GND TSV are both weak influencing factors.

About this research paper

What this paper is about

In this paper, some potential influencing factors of the TSV (Through Silicon Via) interposer were analyzed in high frequency bands from 10 GHz to 50 GHz by HFSS software. An interposer model with QFN (Quad Flat No-lead Package)-BGA (Ball Grid Array) transmission structure was designed to investigate the influence of the parameters such as shape, distance of BGA solder joint and TSV. In the model, TSV was used to connect QFN pad and BGA balls to transmit signal. According to the simulation results, the shape and distance of BGA balls significantly affect the RF transmission performance. A cylinder-shape BGA solder joint has better performance. In addition, the radius, distance and shape of TSV have obvious influence on the transmission performance of the interposer in the relative high frequency bands. The T-shape of TSV, short distance between RF TSV and GND TSV are both weak influencing factors.

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Available abstract

In this paper, some potential influencing factors of the TSV (Through Silicon Via) interposer were analyzed in high frequency bands from 10 GHz to 50 GHz by HFSS software. An interposer model with QFN (Quad Flat No-lead Package)-BGA (Ball Grid Array) transmission structure was designed to investigate the influence of the parameters such as shape, distance of BGA solder joint and TSV. In the model, TSV was used to connect QFN pad and BGA balls to transmit signal. According to the simulation results, the shape and distance of BGA balls significantly affect the RF transmission performance. A cylinder-shape BGA solder joint has better performance. In addition, the radius, distance and shape of TSV have obvious influence on the transmission performance of the interposer in the relative high frequency bands. The T-shape of TSV, short distance between RF TSV and GND TSV are both weak influencing factors.

Key concepts: Ball grid array, Interposer, Quad Flat No-leads package, Through-silicon via, Materials science, HFSS, Chip-scale package, Soldering

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