2018•Unpublished venueRequires access

Evaluation of thermal resistance of various thermal grease

Shu Seki, Ryo Endoh, M. Takeda

Abstract

Thermal conductivity is a general performance index of the thermal interface material (TIM) used between the board and the heat sink. However, the actual thermal resistance of the interface between the substrate and the heat sink is also important. A TEG using a plurality of TIMs was prepared and thermal resistance was evaluated.

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Available abstract

Key concepts: Thermal resistance, Thermal grease, Thermal conductivity, Heat sink, Materials science, Thermal, Composite material, Interfacial thermal resistance