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2017•Microsystem TechnologiesRequires access

Optimizing the dicing saw parameters of 60 μm wafer dicing street

Te‐Jen Su, Yifeng Chen, Jui-Chuan Cheng, Chien‐Liang Chiu

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Key concepts: Wafer dicing, Wafer, Materials science, Diamond, Wafer testing, Die preparation, Wafer backgrinding, Engineering drawing

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