2017•Applied Thermal EngineeringRequires access

Optimization of the thermal distribution of multi-chip LED package

K. Ben Abdelmlek, Zouhour Araoud, Kamel Charrada, Georges Zissis

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Key concepts: Multiphysics, Junction temperature, Materials science, Chip, Light-emitting diode, Thermal management of high-power LEDs, Thermal resistance, Optoelectronics

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Optimization of the thermal distribution of multi-chip LED package — Research Paper | ScholarLens