Introduction to Package

Package provides necessary electrical interconnections, mechanical support, environmental protection and thermal structure for semiconductor chips. Package can be divided into ceramic package, metal package and plastic package. With the improvement of IC chip running speed and geometry shrink, package design and manufacturing has become more and more important for system applications. This chapter shows the development trends of electronic packaging technology. SiP system-level packaging technology is one of the most important future directions; it will also become a more and more important solution in the microelectronics industry. The well-known SiP technologies are chip stacking, embedded components, substrate cavity, IPD, TSV and PoP. In the global electronics market, mobile communication products have become the most important area of SiP application. Mobile phone applications, whether baseband module, wireless module, RF module or camera module, are the main applications using SiP. Shennan Circuits Co. Ltd (SCC) is constantly improving its SiP packaging and testing technics process.