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2011•The Proceedings of the Materials and Mechanics ConferenceOpen access

OS1208 A Study on Impact Strength of Ceramic Chip Embedded in Printed Circuit Board

Tomohiro Inagaki, Takashi Kawakami, Takahiro Kinoshita, Noriyo HORIKAWA, S. Nishide

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Abstract

In this study, impact stress simulations for electronic ceramic chips mounted on/in printed circuit boards (PCB) were carried out with general purpose large scale stress analysis code. To verify the structural integrity of PCB under impact load, Jig drop test, Ball drop test and Bar drop test, are widely used in electronic industries. As results of simulations, embedded device is slightly severer than surface mounted devices.

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What this paper is about

In this study, impact stress simulations for electronic ceramic chips mounted on/in printed circuit boards (PCB) were carried out with general purpose large scale stress analysis code. To verify the structural integrity of PCB under impact load, Jig drop test, Ball drop test and Bar drop test, are widely used in electronic industries. As results of simulations, embedded device is slightly severer than surface mounted devices.

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Available abstract

In this study, impact stress simulations for electronic ceramic chips mounted on/in printed circuit boards (PCB) were carried out with general purpose large scale stress analysis code. To verify the structural integrity of PCB under impact load, Jig drop test, Ball drop test and Bar drop test, are widely used in electronic industries. As results of simulations, embedded device is slightly severer than surface mounted devices.

Key concepts: Drop test, Printed circuit board, Drop impact, Ceramic, Drop (telecommunication), Ball (mathematics), Chip-scale package, Materials science

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