J031021 Heat Transfer Characterization of Microchannel by Numerical Calculation

In this study, we fabricated microchannel for cooling of the electronic components. Microchannel was made of polydimethylsiloxane (PDMS) elastomer using soft lithography techniques. An epoxy-based photoresist (SU-8) was used as a master mold to induce soft lithography. The fabricated microchannel had a rectangular flow path with length of 24mm, width of 500pm and depth of 50vtm. We measured heat flux for water flows in the fabricated microchannel with heated plate. Water flows were laminar fully developed flow. The maximum heat flux was 44W/cm^2 for a 38K temperature difference, and flow rate of 2.0 cm^3/min. We simulate the experiment, and numerical calculation results were compared with experimental results. We clear measurements problems from the difference of experimental and numerical results.