2003Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuuOpen access

Analysis of Thermally Grown Oxide Layer at Thermal Barrier Coating Interface

Yasuhiro Ohtake, Tadashi Natsumura

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Abstract

Thermally grown oxide (TGO) layer is grown at the interface between top coating and bond coating when a thermal barrier coating (TBC) with both top coating and bond coating is heated. The growth of the TGO layer causes the delamination of top coating from bond coating after heating. In this paper, the growth of TGO layer was simulated by finite element analysis, and then the stresses in the coating system were examined near the top/bond coatings interface. It was found that the occurrence of the delamination of top coating was affected by the thickness of TGO layer, the geometry of the interface, the temperature at interface, the properties of those materials. The delamination of top coating was also effected by those parameters because the location of the occurrence of the maximum stress was changed in according to the growth of TGO layer.

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Thermally grown oxide (TGO) layer is grown at the interface between top coating and bond coating when a thermal barrier coating (TBC) with both top coating and bond coating is heated. The growth of the TGO layer causes the delamination of top coating from bond coating after heating. In this paper, the growth of TGO layer was simulated by finite element analysis, and then the stresses in the coating system were examined near the top/bond coatings interface. It was found that the occurrence of the delamination of top coating was affected by the thickness of TGO layer, the geometry of the interface, the temperature at interface, the properties of those materials. The delamination of top coating was also effected by those parameters because the location of the occurrence of the maximum stress was changed in according to the growth of TGO layer.

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Available abstract

Thermally grown oxide (TGO) layer is grown at the interface between top coating and bond coating when a thermal barrier coating (TBC) with both top coating and bond coating is heated. The growth of the TGO layer causes the delamination of top coating from bond coating after heating. In this paper, the growth of TGO layer was simulated by finite element analysis, and then the stresses in the coating system were examined near the top/bond coatings interface. It was found that the occurrence of the delamination of top coating was affected by the thickness of TGO layer, the geometry of the interface, the temperature at interface, the properties of those materials. The delamination of top coating was also effected by those parameters because the location of the occurrence of the maximum stress was changed in according to the growth of TGO layer.

Key concepts: Coating, Thermal barrier coating, Materials science, Delamination (geology), Layer (electronics), Composite material, Oxide, Stress (linguistics)

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