2009•Keisan Rikigaku Koenkai koen ronbunshu/Keisan Rikigaku Kouenkai kouen rombunshuuOpen access

1323 Study on failure mechanism of die during a forging process : FE analysis of the die and fatigue behavior of the die material

S. YOSHIFUJI, Shotaro Ishihara, Akio HORITA, M. Kawamoto, Masahiro SAWAI, Masaya TAKATA, Eiichi KUROSAKI

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Key concepts: Die (integrated circuit), Forging, Mechanism (biology), Materials science, Metallurgy, Engineering, Mechanical engineering, Philosophy

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1323 Study on failure mechanism of die during a forging process : FE analysis of the die and fatigue behavior of the die material — Research Paper | ScholarLens