2017•Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIERequires access
Nanoimprint, DSA, and multi-beam lithography: patterning technologies with new integration challenges
S. Landis, H. Teyssèdre, G. Claveau, I. Servin, F. Delachat, Marie-Line Pourteau, A. Gharbi, Patricia Pimenta‐Barros, Raluca Tiron, Lamia Nouri, N. Possémé, Michael May, P. Brianceau, S. Barnola, Yoann Blancquaert, Jonathan Pradelles, Philippe Essomba, Arthur Bernadac, B. Dal’zotto, Sandra Bos, Maxime Argoud, G. Chamiot-Maitral, A Sarrazin, C. Tallaron, C. Lapeyre, L. Pain
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Abstract
In the lithography landscape, EUV technology recovered some credibility recently. However, its large adoption remains uncertain. Meanwhile, 193nm immersion lithography, with multiple-patterning strategies, supports the industry preference for advanced-node developments. In this landscape, lithography alternatives maintain promise for continued R&D. Massively parallel electron-beam and nano-imprint lithography techniques remain highly attractive, as they can provide noteworthy cost-of-ownership benefits. Directed self-assembly lithography shows promising resolution capabilities and appears to be an option to reduce multi-patterning strategies. Even if large amount of efforts are dedicated to overcome the lithography side issues, these solutions introduce also new challenges and opportunities for the integration schemes.