Influence of Different Parameters on Heat Pipe Performance

In electrical and electronic industry due to miniaturization of electronic components heat density increases which, in turns increases the heat flux inside it. Scientist and many researchers are doing lot of work in this field for thermal management of devices. Heat pipe is a device that is used in electronic circuit (micro and power electronics), spacecraft & electrical components for cooling purpose. It is based on the principle of evaporation and condensation of working fluid. Heat pipe made up of three main parts are evaporator, adiabatic and condenser sections. In this working fluid vaporise at evaporator and transfers heat to condenser by adiabatic section where heat release to surrounding. Vapour flows possible from evaporator to condenser section due to vapour pressure difference exist between them. Use of heat pipe material, type of working fluid & its property, wick structure, orientation, filled ratio, operating condition, dimensions of pipe has a prominent effect on heat pipe performance. Variation of these parameters for minimum thermal resistance gives better performance. HISTORY OF HEAT PIPE: Heat pipe is a device used for maintaining temperature of micro, power electronics devices and aerospace industry. Initially origin of heat pipe occurred since 1836s by A. M. Perkins and J. Perkins, but he toyed with concept of working fluid in only single phase at high temperature. In 1944 R.S. Gougler used another important thing is called wick. This wick is necessary for heat pipe other than thermosyphon. In 1962 G.M. Grover and his co-workers from Los Alamos scientific laboratory made a prototype on the design and coined the name “HEAT PIPE”. In Heat pipe thermal conductivity and phase change phenomenon is used to dissipate the heat to surrounding.