1995European Solid-State Device Research ConferenceRequires access

A Simple Method to Extract the Parasitic Resistances from a Single MOSFET using Measurements of Small-Signal Conductances

A. Raychaudhuri, M. Jamal Deen, M.I.H. King, J. Kolk

Open publisher page 5 citations

Abstract

In this paper, we present a new and simple method to extract the source (R S ) and drain (R D ) parasitic resistances of a MOSFET separately, using small-signal transconductance (g m ) and drain conductance (g d ) measurements on a single MOSFET. Unlike most earlier methods that depend on the measurements of the d.c. resistances of several MOSFETs, our method can be directly applied to situations involving the early-mode hot-carrier degradation where the source and drain resistances differ due to stressing, and asymmetrical layouts or processing of source and drain sides. The method yields reasonably accurate values of R S and R D when compared with a conventional method. The error terms are also discussed.

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What this paper is about

In this paper, we present a new and simple method to extract the source (R S ) and drain (R D ) parasitic resistances of a MOSFET separately, using small-signal transconductance (g m ) and drain conductance (g d ) measurements on a single MOSFET. Unlike most earlier methods that depend on the measurements of the d.c. resistances of several MOSFETs, our method can be directly applied to situations involving the early-mode hot-carrier degradation where the source and drain resistances differ due to stressing, and asymmetrical layouts or processing of source and drain sides. The method yields reasonably accurate values of R S and R D when compared with a conventional method. The error terms are also discussed.

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Available abstract

In this paper, we present a new and simple method to extract the source (R S ) and drain (R D ) parasitic resistances of a MOSFET separately, using small-signal transconductance (g m ) and drain conductance (g d ) measurements on a single MOSFET. Unlike most earlier methods that depend on the measurements of the d.c. resistances of several MOSFETs, our method can be directly applied to situations involving the early-mode hot-carrier degradation where the source and drain resistances differ due to stressing, and asymmetrical layouts or processing of source and drain sides. The method yields reasonably accurate values of R S and R D when compared with a conventional method. The error terms are also discussed.

Key concepts: Transconductance, MOSFET, Conductance, Parasitic element, SIGNAL (programming language), Materials science, Electronic engineering, Degradation (telecommunications)

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