2010•Unpublished venueRequires access

Performance analyse on millimetre-wave bonding-wire interconnection

Jiankang Li, Yong‐Zhong Xiong, Sanming Hu, Wang Ling Goh, Debin Hou, Wen Wu

Abstract

This paper presents a comprehensive analysis of the electrical performance of the bonding-wire interconnection up to 170 GHz. The effects of the wire length, loop height and pad area have all been analyzed. An electrical model for the bonding-wire is discussed. By reducing interconnection distance and optimizing pad area, the performance of the bonding-wire can be enhanced. The acceptable measurement results of the bonding-wire up to 170 GHz are obtained.

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Available abstract

Key concepts: Interconnection, Wire bonding, Millimetre wave, Materials science, Millimeter, Optoelectronics, Electrical engineering, Electronic engineering