2005•Unpublished venueRequires access
Super cooling structures for power electronics
Ewa Raj, Zbigniew Lisik, Małgorzata Langer, J. Rudzki
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Abstract
The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1 K/W