Mechanical and Thermal Properties of Al2O3-Filled Epoxy Composites
Xiaoping Zhang, Fan Sun, Bo Wang, Jianfeng Yang, Wei Ding, Chang Yeoul Kim
Abstract
Xiaoping Zhang, Fan Sun, Bo Wang, Jianfeng Yang, Wei Ding, Chang Yeoul Kim
Abstract
The paper presents studies of influences of platelet-shape alumina content on the morphology, mechanical and thermal properties of Al2O3/epoxy composites. The alumina particles were pre-treated with surface modifier, and its addition contents were ranged from 17 to 40vol.%. It was found that tensile strength and thermal conductivity increased with the increase of the alumina contents. The fracture surface investigation showed that several strengthening mechanisms, including particles pull-out, crack pinning, plastic void growth and deformation were the main factors for the increments of the tensile strength of the Al2O3/epoxy composites. Comparing with pure epoxy polymer, the creep strain values at 70 °C for 1800 s and recovery strain after 3600 s of 40vol.%Al2O3/epoxy composites was lower as 0.23% and 70%, respectively. It was due to effective prohibition of the slippage and disentanglement of epoxy polymer molecules by the rigid Al2O3.
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The paper presents studies of influences of platelet-shape alumina content on the morphology, mechanical and thermal properties of Al2O3/epoxy composites. The alumina particles were pre-treated with surface modifier, and its addition contents were ranged from 17 to 40vol.%. It was found that tensile strength and thermal conductivity increased with the increase of the alumina contents. The fracture surface investigation showed that several strengthening mechanisms, including particles pull-out, crack pinning, plastic void growth and deformation were the main factors for the increments of the tensile strength of the Al2O3/epoxy composites. Comparing with pure epoxy polymer, the creep strain values at 70 °C for 1800 s and recovery strain after 3600 s of 40vol.%Al2O3/epoxy composites was lower as 0.23% and 70%, respectively. It was due to effective prohibition of the slippage and disentanglement of epoxy polymer molecules by the rigid Al2O3.
Key concepts: Materials science, Epoxy, Composite material, Slippage, Ultimate tensile strength, Void (composites), Polymer, Thermal conductivity