2016•Journal of Materials Science Materials in ElectronicsRequires access

Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress

Baolei Liu, Yanhong Tian, Jing‐Kai Qin, Rong An, Rui Zhang, Chenxi Wang

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Key concepts: Electromigration, Ball grid array, Current crowding, Materials science, Soldering, Current density, Joule heating, Microelectronics

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Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress — Research Paper | ScholarLens