1986•Conference on Lasers and Electro-OpticsRequires access
Laser drilling of via holes in green ceramic
J. J. Seksinsky, P. P. Lu, J. H. Koestner, Tack-hyun Jung
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Abstract
In the fabrication of multilayered packages, electrical vias or feedthroughs are required to electrically interconnect the various layers of the package. Traditionally, these vias have been generated in the sheet by mechanical methods which have limitations. Lasers are being evaluated as a possible alternative method of generating via holes. The main concern in laser drilling is via quality, consistency, and throughput.