Adhesion of dentin bonding agents after smear layer treatments.
Elaine L. Davis, Gerard Wieczkowski, Yu Xy, Joynt Rb, John R Gallo
Abstract
Elaine L. Davis, Gerard Wieczkowski, Yu Xy, Joynt Rb, John R Gallo
Abstract
The effect on bond strength of smear layer removal (40% polyacrylic acid or 10% phosphoric acid) versus smear layer conditioning for dentin bonding agents requiring conditioning was compared. Results indicated no difference in shear bond strength for groups in which the smear layer was conditioned or removed with phosphoric acid. Smear layer removal with polyacrylic acid resulted in lower bond strengths between DBAs and dentin than either phosphoric acid removal or conditioning (P less than 0.01). Scanning electron photomicrographs of dentin treated with each dentin bonding agent revealed various surface morphologies.
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The effect on bond strength of smear layer removal (40% polyacrylic acid or 10% phosphoric acid) versus smear layer conditioning for dentin bonding agents requiring conditioning was compared. Results indicated no difference in shear bond strength for groups in which the smear layer was conditioned or removed with phosphoric acid. Smear layer removal with polyacrylic acid resulted in lower bond strengths between DBAs and dentin than either phosphoric acid removal or conditioning (P less than 0.01). Scanning electron photomicrographs of dentin treated with each dentin bonding agent revealed various surface morphologies.
Key concepts: Smear layer, Dentin, Phosphoric acid, Polyacrylic acid, Bond strength, Materials science, Adhesion, Layer (electronics)