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2015•Unpublished venueRequires access

Room Temperature Bonding of Heterogeneous Materials for Near-Infrared Image Sensor

Takahiro Shuto, Keiichiro Iwanabe, M. Ogura, K. Nishida, Tanemasa Asano

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Abstract

A room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared (NIR) image sensor. The image sensor is fabricated using the chip-on-chip integration of an InGaAs photodiode array on an InP substrate and a Si CMOS readout IC. The pixel pitch is 25 µm to compose quarter-VGA class (320 × 256 pixels) resolution. A high-quality imaging of a heated object is demonstrated. Bonding of the VGA array with 15 µm pitch is attempted to realize a high-resolution image sensor.

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What this paper is about

A room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared (NIR) image sensor. The image sensor is fabricated using the chip-on-chip integration of an InGaAs photodiode array on an InP substrate and a Si CMOS readout IC. The pixel pitch is 25 µm to compose quarter-VGA class (320 × 256 pixels) resolution. A high-quality imaging of a heated object is demonstrated. Bonding of the VGA array with 15 µm pitch is attempted to realize a high-resolution image sensor.

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Available abstract

A room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a near-infrared (NIR) image sensor. The image sensor is fabricated using the chip-on-chip integration of an InGaAs photodiode array on an InP substrate and a Si CMOS readout IC. The pixel pitch is 25 µm to compose quarter-VGA class (320 × 256 pixels) resolution. A high-quality imaging of a heated object is demonstrated. Bonding of the VGA array with 15 µm pitch is attempted to realize a high-resolution image sensor.

Key concepts: Video Graphics Array, Materials science, Dot pitch, Image sensor, Photodiode, Optoelectronics, Fabrication, Pixel

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