A computer simulation of the creep process of the cell wall using stress relaxation parameters
Ryōichi Yamamoto, Naoki Sakurai
Abstract
Ryōichi Yamamoto, Naoki Sakurai
Abstract
The stress relaxation of the cell wall of pea plants was measured and viscoelastic parameters were obtained according to the stress-relaxation analysis developed by Yamamoto et al. (Plant & Cell Physiol. 1970). The creep process of the cell wall was simulated by a numerical integration using stress-relaxation parameters, because the direct conversion of the stress relaxation process to the creep is impractical. In the conversion, a personal computer was programmed for the Maxwell viscoelastic model with a compiler language. Cell wall creep was measured with a specially constituted apparatus and compared with that calculated by the simulation process. The results suggested that the creep can be reproduced by a computer simulation using the stress-relaxation parameters. Both creep and stress-relaxation properties of plant cell walls can be analyzed by using a single model.
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The stress relaxation of the cell wall of pea plants was measured and viscoelastic parameters were obtained according to the stress-relaxation analysis developed by Yamamoto et al. (Plant & Cell Physiol. 1970). The creep process of the cell wall was simulated by a numerical integration using stress-relaxation parameters, because the direct conversion of the stress relaxation process to the creep is impractical. In the conversion, a personal computer was programmed for the Maxwell viscoelastic model with a compiler language. Cell wall creep was measured with a specially constituted apparatus and compared with that calculated by the simulation process. The results suggested that the creep can be reproduced by a computer simulation using the stress-relaxation parameters. Both creep and stress-relaxation properties of plant cell walls can be analyzed by using a single model.
Key concepts: Creep, Stress relaxation, Viscoelasticity, Stress (linguistics), Relaxation (psychology), Materials science, Process (computing), Mechanics