2005•Unpublished venueRequires access

Reflow Solder Profile Development

Liang Wan-lei

Abstract

In this paper, we analyze the function of the thermal reflow profile in reflow process, characteristics of reflow process, factors of thermal reflow profile. How to build up methods of thermal reflow profile in the idea of thermal capacity. How to adjust thermal reflow profile. We control thermal reflow profile for increasing quality of reflow process and decreasing failures of reflow process.

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Available abstract

Key concepts: Reflow soldering, Thermal, Process (computing), Soldering, Materials science, Mechanical engineering, Process engineering, Engineering