Mo-Mo diffusion bonding by using Ti foil as interlayer
Hao Shi Ming
Abstract
Hao Shi Ming
Abstract
Two Molybdenum substrates with 5 μm Ti foil as interlayer,were welded by vacuum diffusion bonding in the condition of bonding temperature 1 000 ℃,axial pressure 10 MPa and holding time 60 min.The interface topography was observed by Scanning Electron Microscope(SEM),and its Energy Disperse Spectroscopy was used to test and analyze element interdiffusion and elementary composition at the interface.As a consequent,for the excellent atoms interdiffusion between Ti foil and Mo substrate,Mo/Ti solid solution was generated at the interface region.Therefore,Vacuum Diffusion Bonding of Molybdenum substrates with Ti foil as interlayer could obtain sound Mo-Ti-Mo joint,with interface bonding rate reaching to 100%.
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Two Molybdenum substrates with 5 μm Ti foil as interlayer,were welded by vacuum diffusion bonding in the condition of bonding temperature 1 000 ℃,axial pressure 10 MPa and holding time 60 min.The interface topography was observed by Scanning Electron Microscope(SEM),and its Energy Disperse Spectroscopy was used to test and analyze element interdiffusion and elementary composition at the interface.As a consequent,for the excellent atoms interdiffusion between Ti foil and Mo substrate,Mo/Ti solid solution was generated at the interface region.Therefore,Vacuum Diffusion Bonding of Molybdenum substrates with Ti foil as interlayer could obtain sound Mo-Ti-Mo joint,with interface bonding rate reaching to 100%.
Key concepts: FOIL method, Materials science, Diffusion bonding, Molybdenum, Scanning electron microscope, Diffusion, Diffusion welding, Substrate (aquarium)