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Exploration of Wafer Cleaning before Thermal Oxidation
Yin Wangen
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Abstract
This paper introduces the impact of wafer contamination on the quality of oxide film that grew out of thermal oxidation.Through array of experiments on wafer surface contamination cleaning before thermal oxidation,the paper analyses the impact of solvent concentration,temperature and ultra-sonic on cleaning,and makes a study of micro-roughness,etch point after cleaning.According to the study results,takes improved process,and reaches an optimal cleaning effects.