2010•Cailiao gongchengRequires access
Microstructural Evolution of TLP Bonded Ti_3Al Based Alloy/Ti-6Al-4V Joint
Duan Zhen-zhen
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Abstract
Composition,microstructural evolution and micro-hardness of TLP bonded Ti3Al based alloy/Ti-6Al-4V joints have been studied using a TiZrNiCu alloy as interlayer.Experimental results showed that bonding temperature and bonding time have a great effect on joint composition and microstructure.With increasing bonding temperature and bonding time,composition distribution of joint had a uniform tendency and width of the bond zone increased.When bonding temperature were 850℃ and 900℃,Ti-Cu intermetallics were found in the joint due to the existence of residual liquid.When bonding temperature was 950℃ and bonding time was 30min,Ti-Cu intermetallics disappeared from the joint owing to completion of isothermal solidification.Micro-hardness of bond zone decreased as bonding temperature and bonding time were increased.When bonding temperature was 950℃ and bonding time was 30min,the joint acquired a relatively uniform micro-hardness distribution.