2009Electroplating & FinishingRequires access

Electroless nickel plating process in small bulk plating solution

Liu Guo-pin

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Abstract

The effects of concentration ratio of main salt and reducing agent, temperature, pH, and reaction time on the deposition rate of electroless nickel on irregular-shaped Y1Cr18Ni9 stainless steel substrate in a ca. 2 mL plating bath were studied. The results showed that the deposition is fast under the conditions of Ni2+ to H 2 PO2- concentration ratio 0.75:1, temperature 77 °C, pH 6 and reaction time 2 h. The electrolessly deposited nickel coating is uniform and compact with a nickel content exceeding 72%.

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The effects of concentration ratio of main salt and reducing agent, temperature, pH, and reaction time on the deposition rate of electroless nickel on irregular-shaped Y1Cr18Ni9 stainless steel substrate in a ca. 2 mL plating bath were studied. The results showed that the deposition is fast under the conditions of Ni2+ to H 2 PO2- concentration ratio 0.75:1, temperature 77 °C, pH 6 and reaction time 2 h. The electrolessly deposited nickel coating is uniform and compact with a nickel content exceeding 72%.

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Available abstract

The effects of concentration ratio of main salt and reducing agent, temperature, pH, and reaction time on the deposition rate of electroless nickel on irregular-shaped Y1Cr18Ni9 stainless steel substrate in a ca. 2 mL plating bath were studied. The results showed that the deposition is fast under the conditions of Ni2+ to H 2 PO2- concentration ratio 0.75:1, temperature 77 °C, pH 6 and reaction time 2 h. The electrolessly deposited nickel coating is uniform and compact with a nickel content exceeding 72%.

Key concepts: Nickel, Plating (geology), Materials science, Electroless plating, Electroless nickel plating, Deposition (geology), Metallurgy, Coating

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