Development of high-temperature lead-free solder in electronic micro-connection
Gan Shu-de
Abstract
Gan Shu-de
Abstract
Based on the requirement of environmental protection and human health,lead-free solder used electronic products instead of the traditional leaded solder was inevitable trend.This paper summarized the basic requirements of new high-temperature lead-free solder.Several kind of solder research status at home and abroad about Bi alloy,Au alloy,Zn alloy and Sn-Sb alloy and so on,were reviewed.Developing high-temperature lead-free solder with cost and performance comparable to lead solder by the way of the multi-component phase diagram calculation,alloying and composite method.
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Based on the requirement of environmental protection and human health,lead-free solder used electronic products instead of the traditional leaded solder was inevitable trend.This paper summarized the basic requirements of new high-temperature lead-free solder.Several kind of solder research status at home and abroad about Bi alloy,Au alloy,Zn alloy and Sn-Sb alloy and so on,were reviewed.Developing high-temperature lead-free solder with cost and performance comparable to lead solder by the way of the multi-component phase diagram calculation,alloying and composite method.
Key concepts: Soldering, Materials science, Lead (geology), Alloy, Metallurgy, Solder paste, Phase (matter), Organic chemistry