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STRESS FIELD AROUND CRACK TIPS IN A CURRENT-CARRYING PLATE WHILE THE CURRENT IS SWITCHED ON

Bai Xiangzhon

Abstract

The stress field around crack tips in an infinite thin current-coping plate at the moment while the current is switched on is studied. The temperature field around the crack bps can be solved by the means of the power expressions of Joule heat scarce attributed from the concentration effect of the current with given intensity and the heat conduction. Based on the solution of temperature field, a calculating method for the stress field around the crack bps can be obtained at last. The calculated examples show that relatively big compressive stresses can be produced around the crack tips, if the parameters have been set up previously and a current with proper intensity has been switched on. So the goal of preventing the spread of cracking can be anied.

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Key concepts: Current (fluid), Materials science, Stress intensity factor, Joule heating, Crack tip opening displacement, Stress field, Mechanics, Field (mathematics)