Fabrication and characterization of nanoporous silica film
WU Xiao-qing
Abstract
WU Xiao-qing
Abstract
Crack-free homogeneous nanoporous silica films were prepared with colloidal silica sol derived by sol-gel process of tetraethylorthosilicate (TEOS) catalyzed with R4N+OH-. The solution with ratio of H2O/TEOS25, R4N+ and glycerol were combined with the intermediate Si(OR)4-x;(OH)x and SixOy(OH)z+nr avoiding aggregation of the nanosilica particles, presence of the poly(vinyl alcohol) (PVA) made colloidal silica sol a polymeric structure (filming easily). The silica films have heterostructure, which can avoid crack of the nanoporous silica films during being annealed. The homogeneous nanoporous silica films can develop due to accumulated structure of silica particle within films during annealing. The pore sizes distribute between 100-200 nm after annealed at 850 ℃ for 30 min. The refractive indexes were 1.27-1.42, the dielectric constant was 1.4-2, the thermal conductivity was 0.2 W/m.K.
OpenAlex reports 1 citations for this work. Citation counts describe recorded attention and do not establish research quality.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
Crack-free homogeneous nanoporous silica films were prepared with colloidal silica sol derived by sol-gel process of tetraethylorthosilicate (TEOS) catalyzed with R4N+OH-. The solution with ratio of H2O/TEOS25, R4N+ and glycerol were combined with the intermediate Si(OR)4-x;(OH)x and SixOy(OH)z+nr avoiding aggregation of the nanosilica particles, presence of the poly(vinyl alcohol) (PVA) made colloidal silica sol a polymeric structure (filming easily). The silica films have heterostructure, which can avoid crack of the nanoporous silica films during being annealed. The homogeneous nanoporous silica films can develop due to accumulated structure of silica particle within films during annealing. The pore sizes distribute between 100-200 nm after annealed at 850 ℃ for 30 min. The refractive indexes were 1.27-1.42, the dielectric constant was 1.4-2, the thermal conductivity was 0.2 W/m.K.
Key concepts: Nanoporous, Materials science, Sol-gel, Dielectric, Colloidal silica, Chemical engineering, Annealing (glass), Colloid