HE Wen-dong
Abstract
The epoxy resin adhesive was introduced in terms of main properties and features.The used methods for increasing the heat resistance of epoxy resin adhesives in recent years were discussed.The limitation of application,the current research situation and the future development trend of heat-resistant epoxy adhesives were also reviewed in brief.
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The epoxy resin adhesive was introduced in terms of main properties and features.The used methods for increasing the heat resistance of epoxy resin adhesives in recent years were discussed.The limitation of application,the current research situation and the future development trend of heat-resistant epoxy adhesives were also reviewed in brief.
Key concepts: Epoxy, Adhesive, Materials science, Heat resistance, Epoxy adhesive, Composite material, Composite epoxy material, Layer (electronics)