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Research on Heat-release Package of LED

LI Chao-lin

Abstract

Thermal dissipation in high-power is discoursed; it explained its influence on output power and life. The influence of luminous efficiency and life in low power LED, high power LED and high power LED module is analyzed. How to improve the heat-release capability is one of the key technical problems for the package and application design of device concerned with high-power LEDs. Thermal dissipation is important for power LED and LED module design because luminous efficiency and lifetime of high-power white LEDs are limited by heat dissipation. The present technical research on heat-release package of high-power LEDs is analyzed. Besides, it mentions that influence of material and structure of LEDs package. Temperature distribution of LED module may be come to notice in the future. Temperature can be dramatically decreased by increasing thermal conductivity of package materials. In the end the trend is summarized.

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Available abstract

Key concepts: Thermal management of high-power LEDs, Light-emitting diode, Junction temperature, Luminous efficacy, Thermal management of electronic devices and systems, LED lamp, Dissipation, Power (physics)