2004•Chalmers Publication Library (Chalmers University of Technology)Requires access
Wafer bonding: A flexible way to manufacture SOI materials for high performance applications
Stefan Bengtsson, Petra Amirfeiz, Mikael Johansson
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Abstract
An overview is given on the use of wafer bonding for formation of Silicon-On-Insulator (SOI) materials for high performance applications. Recent developments in wafer bonding and available techniques for formation of thin semiconductor films is presented. Furthermore, a review is given on results in use of wafer bonding for formation of advanced SOI-materials. Finally, a more detailed discussion is given on the use of wafer bonding for manufacture of SOI-materials intended for high-frequency applications and SOI-materials with films of electrically insulating but highly thermally conductive materials as buried insulators.