Status of Techniques on Heat Dissipation in Electronic Components

With the rapid development of high frequency, high integration of electronic components and the integrated circuit technique, and the great improvement of MEMS, their power density are significantly increased, which leads to higher temperature environment affecting the performance of themselves. More effective heat control is required. Therefore, it is the key technique in the packing and fabricating process that effectively solving the problem of heat dissipation in electronic components. The paper summed up the principles and various cooling methods to eliminating temperature effects in the actual application.