The study of nano-copper colloid used in conductive ink
Huang Jun-sheng
Abstract
Huang Jun-sheng
Abstract
Using KBH4 as a reducing agent,copper sulfate(CuSO4·5H2O) as precursors,(EDTA-2Na) as complexing agent and added CTAB as surfactant,KOH as pH adjusting agent;And studied the influence of the concentration of additives on nano-copper colloidal particle size and dispersion stability;The results showed that: when the amount of CTAB,KOH,CEDTA-2Na is 0.22mol/L,1.5 mol/L,0.3-0.4 mol/L got the best results of nano-copper colloid particle size and dispersion stability;By chemical reduction a minimum particle size of 1.09 nm pure nano-copper was prepared.Under the protection of polyvinyl pyrrolidone(PVP),which can effectively prevent the oxidation of the nano-copper powder.
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Using KBH4 as a reducing agent,copper sulfate(CuSO4·5H2O) as precursors,(EDTA-2Na) as complexing agent and added CTAB as surfactant,KOH as pH adjusting agent;And studied the influence of the concentration of additives on nano-copper colloidal particle size and dispersion stability;The results showed that: when the amount of CTAB,KOH,CEDTA-2Na is 0.22mol/L,1.5 mol/L,0.3-0.4 mol/L got the best results of nano-copper colloid particle size and dispersion stability;By chemical reduction a minimum particle size of 1.09 nm pure nano-copper was prepared.Under the protection of polyvinyl pyrrolidone(PVP),which can effectively prevent the oxidation of the nano-copper powder.
Key concepts: Copper, Colloid, Dispersion (optics), Materials science, Particle size, Nano-, Chemical engineering, Pulmonary surfactant