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Finite Element Analysis of Deformation of Fine Stamping Punch Die and Its Influence on Forming Quality

Jun Cai

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Abstract

Finite element software DEFORM-2D was used to simulate the deformation of punch die in fine stamping process.The influences of punch die material,clearance and cavity die radius on the strain and stress of punch die and the quality of forming parts were studied.The results show that the punch die materials with larger elastic modulus can reduce the deformation of punch die and improve the quality of workpieces;fine stamping clearance plays an important role in the stress,strain and forming quality of workpieces;reasonable cavity die radius can reduce the stress and deformation of punch die,improve the quality of parts and die life.

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What this paper is about

Finite element software DEFORM-2D was used to simulate the deformation of punch die in fine stamping process.The influences of punch die material,clearance and cavity die radius on the strain and stress of punch die and the quality of forming parts were studied.The results show that the punch die materials with larger elastic modulus can reduce the deformation of punch die and improve the quality of workpieces;fine stamping clearance plays an important role in the stress,strain and forming quality of workpieces;reasonable cavity die radius can reduce the stress and deformation of punch die,improve the quality of parts and die life.

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Available abstract

Finite element software DEFORM-2D was used to simulate the deformation of punch die in fine stamping process.The influences of punch die material,clearance and cavity die radius on the strain and stress of punch die and the quality of forming parts were studied.The results show that the punch die materials with larger elastic modulus can reduce the deformation of punch die and improve the quality of workpieces;fine stamping clearance plays an important role in the stress,strain and forming quality of workpieces;reasonable cavity die radius can reduce the stress and deformation of punch die,improve the quality of parts and die life.

Key concepts: Die (integrated circuit), Stamping, Deformation (meteorology), Finite element method, Materials science, Forming processes, Stress (linguistics), RADIUS

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