1993•Unpublished venueRequires access
KINETIC STUDIES OF Cu(II)-EDTA-HCHO ELECTROLESS COPPER PLATING SYSTEM
Minghui Tan, Maotian Xu
Open publisher page 0 citations
Abstract
The kinetic behavior of the cathodic reaction and the anodic reaction during Cu(II)-EDTA-HOHO electroless copper plating has been investigated. The dependence of surface concentration of CuEDTA2-, which is reduced to form copper and covered on specimen, on plating time has been determined. The values of stable plating rate calculated from the equation expressing the relation between the stable plating rate and the equilibrium surface concentration of OuEDTA2-are quite consistent with the corresponding measured values. Finally the actual reaction order of electroless copper plating has also been obtained.