2004•Electronic Product Reliability and Environmental TestingRequires access

Analysis of Package Delamination Using ScanningAcoustic Microscope

GU Guan-hua

Abstract

Package delaminations are often associated with electrical and package reliability problems in IC device. Delamination caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations and quickly identify the failure cause at the early stage of failure analysis.

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Available abstract

Key concepts: Delamination (geology), Scanning acoustic microscope, Materials science, Soldering, Reliability (semiconductor), Stress (linguistics), Composite material, Microscope