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Optimizing of Mixed PCB Technology of Reflow Soldering for Aeronautical Product

Ling Yue-hong

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Abstract

SMT welding method is used more and more frequently in aeronautical electronics PCB.Many defects in spot weld such as BGA empty holes and weak jointing come from reflow soldering temperature adjustment.In this paper,the author derives the best reflow soldering temperature with oven temperature testing instruments and thrust experiments,satisfying PCB soldering quality requirements and is highly adaptable.

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What this paper is about

SMT welding method is used more and more frequently in aeronautical electronics PCB.Many defects in spot weld such as BGA empty holes and weak jointing come from reflow soldering temperature adjustment.In this paper,the author derives the best reflow soldering temperature with oven temperature testing instruments and thrust experiments,satisfying PCB soldering quality requirements and is highly adaptable.

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Available abstract

SMT welding method is used more and more frequently in aeronautical electronics PCB.Many defects in spot weld such as BGA empty holes and weak jointing come from reflow soldering temperature adjustment.In this paper,the author derives the best reflow soldering temperature with oven temperature testing instruments and thrust experiments,satisfying PCB soldering quality requirements and is highly adaptable.

Key concepts: Soldering, Reflow soldering, Ball grid array, Welding, Dip soldering, Electronics, Wave soldering, Surface-mount technology

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