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Electroless nickel plating at low temperature and low phosphorus

HE Yan-feng

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Abstract

The effects of temperature,pH,sodium hypophosphite,citric acid and auxiliary complexing agent on the deposition rate and P content of the electroless nickel coating were studied.The optimal bath formulation for alkaline electroless nickel plating at low temperture(40 °C) and low phosphorus(4.15%) was determined as follows:nickel sulfate 25 g/L,sodium hypophosphite 8.0 g/L,citric acid 30 g/L,auxiliary complexing agent(a compound comprising ammonium) 15 g/L and pH 9.0.

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What this paper is about

The effects of temperature,pH,sodium hypophosphite,citric acid and auxiliary complexing agent on the deposition rate and P content of the electroless nickel coating were studied.The optimal bath formulation for alkaline electroless nickel plating at low temperture(40 °C) and low phosphorus(4.15%) was determined as follows:nickel sulfate 25 g/L,sodium hypophosphite 8.0 g/L,citric acid 30 g/L,auxiliary complexing agent(a compound comprising ammonium) 15 g/L and pH 9.0.

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Available abstract

The effects of temperature,pH,sodium hypophosphite,citric acid and auxiliary complexing agent on the deposition rate and P content of the electroless nickel coating were studied.The optimal bath formulation for alkaline electroless nickel plating at low temperture(40 °C) and low phosphorus(4.15%) was determined as follows:nickel sulfate 25 g/L,sodium hypophosphite 8.0 g/L,citric acid 30 g/L,auxiliary complexing agent(a compound comprising ammonium) 15 g/L and pH 9.0.

Key concepts: Sodium hypophosphite, Hypophosphite, Citric acid, Nickel, Electroless nickel plating, Plating (geology), Phosphorus, Chemistry

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