2015•Electronic Components and MaterialsRequires access

Research development on the reliability of board level assembly solder joint under random vibration

Liu Peishen

Abstract

Aimed at the reliability of board-level assembly solder joint under random vibration, the experimental results and simulation results related to the reliability issues are summarized. Firstly, the failure position of the ball grid array(BGA) solder joint, the material of the BGA solder joint and the parameter of BGA and the parameter of printed circuit board(PCB) which influence the reliability of the solder joint are introduced. Then fatigue life prediction method and the Sub-model method, the random vibration analysis of special structure are described. Finally, the optimization method of BGA is proposed.

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Available abstract

Key concepts: Ball grid array, Soldering, Joint (building), Reliability (semiconductor), Printed circuit board, Random vibration, Materials science, Vibration