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Study on the Measurement of Thermal Properties of High-power LEDs

LI Xue-kui, Tan Haishu, Huang Yangcheng

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Abstract

The thermal resistance of high-power LED was analyzed.It is shown that adhesive materials with various thicknesses and thermal conductivities have different thermal resistance,but their effects on the thermal property of LED can not be measured efficiently with common instruments.In this paper,the effects of adhesive materials were measured with infrared thermal imager,and test results indicate that thermal imagers can be used as an efficient method for measuring the thermal property of high-power LEDs.

About this research paper

What this paper is about

The thermal resistance of high-power LED was analyzed.It is shown that adhesive materials with various thicknesses and thermal conductivities have different thermal resistance,but their effects on the thermal property of LED can not be measured efficiently with common instruments.In this paper,the effects of adhesive materials were measured with infrared thermal imager,and test results indicate that thermal imagers can be used as an efficient method for measuring the thermal property of high-power LEDs.

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Available abstract

The thermal resistance of high-power LED was analyzed.It is shown that adhesive materials with various thicknesses and thermal conductivities have different thermal resistance,but their effects on the thermal property of LED can not be measured efficiently with common instruments.In this paper,the effects of adhesive materials were measured with infrared thermal imager,and test results indicate that thermal imagers can be used as an efficient method for measuring the thermal property of high-power LEDs.

Key concepts: Thermal resistance, Materials science, Thermal, Light-emitting diode, Thermal conductivity, Adhesive, Thermal management of high-power LEDs, Thermal infrared

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