Study of Process for Electroless Plating of Ni-Co-PAlloy Coaling
Jia Chen, Hao Shi-xion, Tang Xiao-li
Abstract
Jia Chen, Hao Shi-xion, Tang Xiao-li
Abstract
The effects of the composition and pH value of the plating bath, surfactant, stabilizing agents, and complexing agents on the deposition rate and corrosion resistance of electroless Ni-Co-P alloy coating were studied so as to increase the deposition rate and improve the quality of the electroless Ni-Co-P alloy coating. The optimized bath composition and plating parameters were established. As a result, the optimized plating was suggested to he composed of 26 g/L CoSO4. 28 g/L NiS04, 22 g/L NaH2PO2, 80 g/L Na,C6H5O7, 69 g/L (NH4)2SO4, 1 mg/L, KI, and 50 mg/L C10H28O3SHNa; while the optimized pH value and temperature of the bath were suggested to be 8 and 85℃. It was anticipated that the relevant research results would find promising application in engineering for electroless plating of Ni-Co-P alloy coaling.
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The effects of the composition and pH value of the plating bath, surfactant, stabilizing agents, and complexing agents on the deposition rate and corrosion resistance of electroless Ni-Co-P alloy coating were studied so as to increase the deposition rate and improve the quality of the electroless Ni-Co-P alloy coating. The optimized bath composition and plating parameters were established. As a result, the optimized plating was suggested to he composed of 26 g/L CoSO4. 28 g/L NiS04, 22 g/L NaH2PO2, 80 g/L Na,C6H5O7, 69 g/L (NH4)2SO4, 1 mg/L, KI, and 50 mg/L C10H28O3SHNa; while the optimized pH value and temperature of the bath were suggested to be 8 and 85℃. It was anticipated that the relevant research results would find promising application in engineering for electroless plating of Ni-Co-P alloy coaling.
Key concepts: Plating (geology), Materials science, Alloy, Coating, Metallurgy, Corrosion, Electroless plating, Chelation