2006Precious MetalsRequires access

Study of the Au-Ag-Ge Brazing Alloy

Hong Wu

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Abstract

The composition of Au-19.25Ag-12.8Ge brazing alloy was selected based on analysis of Au-Ag-Ge ternary phase diagram.The Au-19.25Ag-12.8Ge brazing alloy tapes of 0.1mm in thickness were manufactured through cladding hot-rolling and then cold-rolling.The melting characteristics and the wettability on Ni plate of the alloy were tested.It was showed that the liquidus and solidus temperatures of the alloy are 491.0℃ and 445.0℃,respectively,the wetting angles of the alloy on Ni plate are less than 15°under temperature≤ 550℃,and the spreading area on Ni plate is increased with increasing in temperature from 490℃ to 550℃.This alloy could be used for packaging brazing of electronic devices.

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What this paper is about

The composition of Au-19.25Ag-12.8Ge brazing alloy was selected based on analysis of Au-Ag-Ge ternary phase diagram.The Au-19.25Ag-12.8Ge brazing alloy tapes of 0.1mm in thickness were manufactured through cladding hot-rolling and then cold-rolling.The melting characteristics and the wettability on Ni plate of the alloy were tested.It was showed that the liquidus and solidus temperatures of the alloy are 491.0℃ and 445.0℃,respectively,the wetting angles of the alloy on Ni plate are less than 15°under temperature≤ 550℃,and the spreading area on Ni plate is increased with increasing in temperature from 490℃ to 550℃.This alloy could be used for packaging brazing of electronic devices.

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Available abstract

The composition of Au-19.25Ag-12.8Ge brazing alloy was selected based on analysis of Au-Ag-Ge ternary phase diagram.The Au-19.25Ag-12.8Ge brazing alloy tapes of 0.1mm in thickness were manufactured through cladding hot-rolling and then cold-rolling.The melting characteristics and the wettability on Ni plate of the alloy were tested.It was showed that the liquidus and solidus temperatures of the alloy are 491.0℃ and 445.0℃,respectively,the wetting angles of the alloy on Ni plate are less than 15°under temperature≤ 550℃,and the spreading area on Ni plate is increased with increasing in temperature from 490℃ to 550℃.This alloy could be used for packaging brazing of electronic devices.

Key concepts: Brazing, Liquidus, Solidus, Alloy, Materials science, Metallurgy, Wetting, Soldering

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